压合设备及基板与外接电路的绑定方法

Laminating equipment and bonding method for substrate and external circuit

Abstract

本发明提供一种压合设备及基板与外接电路的绑定方法。本发明的压合设备,包括底座、位于底座上方的压板、位于压板上方的上激光源、及位于底座下方的下激光源;所述底座与压板均为透明的材料,使用时,上激光源发出的激光、与下激光源发出的激光分别穿过压板、底座而照射到向各项异性导电胶上对各项异性导电胶进行加热,通过控制上激光源与下激光源只局部对各向异性导电胶进行加热,从而可减少温度对外接电路的影响,解决现有技术中热压使得外接电路膨胀外扩而导致电极对位出错的问题,实现基板与外接电路的精确电极对位,显著提高基板与外接电路的绑定良率和效率,提高产品的电性可靠性。
The invention provides laminating equipment and a bonding method for a substrate and an external circuit. The laminating equipment comprises a base, a pressing plate positioned above the base, an upper laser source positioned above the pressing plate, and a lower laser source positioned below the base, wherein the base and the pressing plate are both made from a transparent material; when the laminating equipment is in use, the laser emitted from upper laser source and the laser emitted from the lower laser pass through the pressing plate and the base respectively to irradiate an anisotropic conductive film for heating the anisotropic conductive film; by controlling the upper laser source and the lower laser source only to partially irradiate the anisotropic conductive film, the influence to the external circuit from temperatures can be reduced; the problem of electrode alignment failure caused by external expansion of the external circuit due to hot pressing in the prior art is solved; accurate electrode alignment of the substrate and the external circuit is realized; and the bonding yield and efficiency of the substrate and the external circuit are obviously improved, so that the electrical reliability of the product is improved.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (0)

    Publication numberPublication dateAssigneeTitle

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle